Low Reflective Chrome Photomask (LRC)
17" x 14" (L x W )
430mm x 355mm
BASE MATERIAL
Available on soda lime glass with a low-reflective chrome pattern etched into the surface. The chrome layer includes a CrO (chrome oxide) top layer to reduce light reflections. Quartz substrates are also available, with other materials offered as special orders. See SPECIFICATIONS for further technical details.
CHOOSING RESOLUTIONS
For LARGE FORMAT photomasks, we offer three standard resolution levels, referred to as "grades." Higher grades provide better quality. See the SPECIFICATIONS section for how each grade affects dimensional accuracy and feature tolerances.
GRADE C: Suitable for features approximately 100 µm and larger. Linewidth tolerance is ±3 µm. Edge sharpness and definition are acceptable for non-critical designs, although arcs, circles, and diagonal lines may exhibit visible pixelation. This is our lowest resolution.
GRADE B: Recommended for features >10 µm where linewidth tolerance can be ±1 µm. Provides good edge quality with minor pixelation. Corner rounding is reduced but still present. This is our mid-level resolution.
GRADE A: Commonly used for high-precision photomasks. Resolves down to 5 µm lines with minimal edge pixelation and excellent corner definition. Linewidth tolerance is ±0.5 µm. Offers a strong balance between cost and performance.
GRADE A+: Available only on selected mask sizes and types. Supports critical features down to 3 µm with linewidth tolerance of ±0.3 µm.
MIN CD
CD stands for "Critical Dimension" and refers to the smallest feature in the design, including both drawn elements and spaces between them. Providing an accurate CD value helps determine appropriate inspection and manufacturing methods. Use the NOTES section to convey any additional information.
CAD FORMAT
Only commonly used formats are listed above. Note that graphic-based formats such as CorelDraw, PDF, PostScript, SVG, BMP, and TIFF are not suitable for submicron accuracy and often introduce dimensional errors. For all high-resolution masks (Class 3 or 4), we strongly recommend vector-based engineering formats such as Gerber, GDSII, DXF, and CIF. If your format is not listed, contact us for clarification. Full drafting services are available if you require us to generate CAD files from drawings or specifications.
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POLARITY Photomasks are defined as Clearfield (positive) or Darkfield (negative). In a positive polarity, CAD data appears as chrome features with a clear glass background. In a negative polarity, CAD data appears clear, and the background is chrome. To determine orientation, include reference text on your design and specify whether it should appear as right reading or wrong reading. Need further clarification? See our instructional video here... |
PRODUCTION SCHEDULE
For LARGE FORMAT photomasks, standard production turnaround is 7–10 working days from receipt of artwork, purchase order, and related documentation. A checkplot will be issued for all orders and must be approved promptly to avoid delays. This timeline assumes that the submitted data is correct and requires no revision. For high-resolution or large-quantity orders, please confirm feasibility before requesting premium turnaround services.
Standard (14 days): Our typical lead time. While 99% of orders ship within this window, actual turnaround may vary during peak periods. Early shipment is often possible when files and paperwork are promptly completed. Orders received after 13:00 are scheduled from the following working day.
7 Days: Premium service. A complete data package (design, order, and instructions) must be received by 11:00. Checkplot approval is expected within 1 hour to avoid delay.
INSPECTION
All photomasks are subject to a rigorous inspection process, regardless of the selected inspection class. Critical parameters such as CD (Critical Dimension) size and uniformity are measured and recorded internally. High-magnification images are captured using Nikon MM40 (900×) and OGP ZIP 300 (400×) systems, and stored with our production records. In some industries—particularly medical or automotive—additional inspection documentation may be required for compliance with quality systems. You can select the level of documentation to be provided with your order.
Standard: Full inspection performed; no documentation issued.
Certificate of Conformance: Printed certificate confirming compliance with inspection criteria.
Certificate of Measurement: Verifies up to 10 user-defined dimensions against specified tolerances. A CAD file or drawing must be provided indicating the positions to be measured. Additional measurements available on request.
CHECKPLOT
Before production, we supply a checkplot—an essential part of our approval workflow. This checkplot is a high resolution PDF graphic, emailed to you for review. It provides an overview of the design layout, helping you confirm pattern alignment, feature placement, and polarity. However, it is a rasterised image and not suitable for verifying precise dimensions.
For critical designs where dimensional accuracy must be confirmed at the CAD level, we recommend using our online CAD checkplot viewer. This platform allows you to inspect your design using vector data, ensuring that features such as linewidth and spacing match your expectations. You can zoom in to inspect fine details, toggle layers, and therefore compare your submitted file against our interpreted version.
Checkplot approval is mandatory before manufacturing begins. No production will start until confirmation is received. Ensure that your review includes polarity, reading direction, and any reference markers required by your process.
For more details, see our Checkplot Information Page.
YOUR DRAWING NUMBER
Please specify the CAD file name or drawing number so we can match the uploaded data to your order.
NOTES
Use this section to provide any additional instructions or specifications related to your order.
Please refer to the TECHNICAL, DOWNLOAD, and FAQ sections for more information. For further clarification, contact us via email or use LIVE SUPPORT.
BASE MATERIAL
COATING
RESOLUTIONS AND ACCURACY
FAQ's
Q: What is the smallest feature that you can produce?
A: This depends on several factors: the imaging resolution, the base material, the polarity of the mask, and the feature type (e.g., spot, square, line). As a general guide, we can consistently produce 5 µm features. With careful process control, we can achieve 3 µm or below in select cases.
Q: How accurate are the features? What tolerances do you work to?
A: Tolerances are resolution-dependent. Our QUICK REFERENCE guide provides a detailed chart of feature and dimensional tolerances by resolution class.
Q: What resolution should I choose?
A: Higher resolution improves edge definition, reduces feature rounding, allows smaller minimum feature sizes, and produces smoother curves and corners. The difference may be subtle or significant depending on your design. If unsure, selecting a higher resolution provides more margin. We’re happy to advise—send us your design database for review.
Q: What does the term "Polarity" mean?
A: Polarity refers to the tone of the photomask—commonly described as Positive (Clearfield) or Negative (Darkfield). In practical terms, it defines whether the features you draw are chrome (opaque) or clear (transparent) on the final mask. This refers to the mask pattern, not the wafer polarity in lithographic processes.
Q: I’ve designed my mask with the wrong polarity—what should I do?
A: We can invert the tone directly from your original design file. There’s no need to supply revised data—just let us know.
Q: What is Right Reading, Wrong Reading, and Mirrored?
A: These terms describe orientation. For photolithography, "Right Reading Chrome Down" means the chrome side is face down (toward the wafer) and the text/design reads correctly. "Wrong Reading" typically refers to a mirrored image. For optical components, "Right Reading Chrome Up" is more common. Always include reference text in your layout and specify your preferred orientation on the order form.
Q: What does 'Negative Data – Right Reading Chrome Down' actually mean?
A: This means that when the photomask is held with the chrome side down and the glass side up, the design reads correctly. However, the pattern will be the inverse (negative) of the data originally drawn in your file.
Q: What file formats do you accept?
A: We accept industry-standard CAD formats such as Gerber, GDSII, DXF, and CIF. For higher-resolution photomasks (Class 3 or 4), we do not recommend design files exported from graphic or publishing software (e.g., CorelDraw, PDF, or SVG), as these can introduce micron-scale inaccuracies. Contact us if your format is not listed—we offer full conversion and drafting services.
Q: What is your standard lead time?
A: Standard production lead time is 14 working days from receipt of artwork, order, and checkplot approval. Expedited services are available for 7 day turnaround, depending on the complexity and resolution class and also the size . if your orderis urgent, please always contact us before placing the order.
Q: How should I clean the photomask?
A: Use clean, lint-free gloves when handling the photomask. For general cleaning, apply filtered deionised water or isopropyl alcohol with a soft, non-abrasive tissue. Do not use compressed air containing oil or debris. Avoid contact with hard objects that may scratch the chrome surface.
Q: Can I reorder the same mask later?
A: Yes. We archive all production data, including CAD files and inspection records, for repeatability. To reorder, reference your previous order number or drawing ID. We will confirm that no changes are required before production.
Q: Can you produce masks from hand drawings or image files?
A: Yes. We offer a full drafting service and can convert sketches, image files (TIFF, BMP, JPG), and annotated PDFs into production-ready CAD data. Additional setup time and charges may apply based on complexity.
Q: Can the same photomask be used multiple times?
A: Yes, provided it is handled correctly and stored in a clean, static-free environment. Reuse depends on your exposure process, resist type, and cleaning method. If used in contact lithography, take care to avoid damage from wafer contact and resist residues.